Yuav ua li cas siv hlau luam ntawv thev naus laus zis los tsim cov kev sib pauv sib pauv sib pauv hloov tsheb?

1. Cov txheej txheem qhia txuj ci siab tau txais yav dhau los cov kev ntsuas geometric ntawm kev tsim khoom lag luam
Hlau 3D PrintingUa rau seem los ntawm kev tsim cov khaubncaws sab nraud povtseg ntawm cov hlau hlau lossis xaim. Nws lub ntsiab kom zoo dua yog tias nws tuaj yeem ua rau muaj kev cuam tshuam sab hauv cov qauv, thiab cov qauv tsim kho kom zoo tshaj plaws uas lwm txoj kev tsis tuaj yeem ua tau. Piv txwv li Team ntawm pab neeg ntxiv ntawm Jihua ntsuas siv Laser Melting (SMCORC) uas yog 80% ntau dua ntawm kev hloov pauv cua sov thiab 52% tsawg dua yuav poob siab. Cov qauv no muaj kauv microchannels thiab kev ua haujlwm biomimetic rau kev txhawb nqa. Nws yog ib qho nyuaj rau ua cov qauv tsim no dua siv cov kev sib deev ib txwm muaj los ntawm lawv tsis tuaj yeem ua kom nyias {}} mm tuab.
Feem ntau txoj kev ua kom muaj kev sib pauv cua sov tam sim no yog nrog cov hmoov txaj (pbf) thev naus laus zis, uas suav nrog SLM thiab Electron nqaj melting (EBM). Piv txwv li, qhov In718 npib tsib xee {2} Raws li kev sib koom tes nrog EP {} Cov khoom siv hluav taws xob ntawm lub teeb kub thiab Suav teb ntawm lub teeb thiab Tuam Tshoj Yij teb 3d, tau ua tsis muaj txeej. Cov fins tau 0.15mm tuab thiab phab ntsa yog 0.5mm tuab. Qhov no tau ua tsaug rau EBM thev naus laus zis, uas txiav cov txheej txheem brazing los ntawm ntau lub lis piam mus txog 130 teev thiab tsa cov khoom siv siv los ntawm 45% mus rau 82%.
2. Kev Tsim Kho Kom Zoo Dua: Txav los ntawm kev paub - Raws li cov ntaub ntawv -
Thaum tsim qauv teeb tsa nyuaj, koj yuav tsum xav txog qhov lawv yuav ua haujlwm rau lawv, thiab lawv yuav ua li cas. Kev tsim qauv tsoos siv txoj kev siv cov qauv sib txawv thiab kev sim siab thiab qhov yuam kev kom pom cov tshuaj zoo tshaj plaws. Cov cuab yeej siv thev naus laus zis hlau, ntawm qhov tod tes, siv kev txhim kho toxy kev txhim kho thiab tsim hluav taws xob zoo nthuav dav qhov chaw tsim.
Thev naus laus zis rau kev ua kom zoo tshaj plaws
Piv txwv li, OQon 3dxpert software muaj ntau - photics fields nyob ntawm seb cov cua sov zoo li kev sim ua raws li cov kev kub ntxhov, kev ntxhov siab, thiab kev ntxhov siab. Piv txwv li, thaum tsim cov cua txias cua txias ua kua rau cov ntaub ntawv cov ntaub ntawv, qhov kev pab cuam ua kom muaj zog ntxiv los ntawm 28% thiab qhov hnyav sib zog los ntawm kev hloov pauv kub (15 qib) thiab ua kom zoo nkauj) thiab 0.2 txog 0.8 hli).
Lattice kev tsim kho uas ua tsis muaj xwm txheej
Lub honeycomb cov qauv thiab cov pab pawg vascular network hauv xwm muab cov tswv yim rau yuav ua li cas los tsim cov kev hloov pauv cua sov. Additive Analytics 'tooj liab alloy runia radicity thiab tau muaj zog ntawm kev hloov pauv ntawm qhov chaw ntom ntom (5% mus rau 30% porosity). Raws li cov ntaub ntawv sim, cov qauv no txhim kho thaj chaw saum npoo los ntawm 2.3 zaug thiab lowers cov kub ua rau tsim qauv nrog tib lub ntim.
Tsim qauv ntawm micchannnel thiab chaceotion convection
Microchanannel Technology ua rau cov cua sov hloov chaw loj dua los ntawm kev ua kom cov kua dej raws me me (tsawg dua 1 hli). Kev xeeb tsaj tsim kev cai ua rau cov kua cua ntau los ntawm kev npaj cov channel hauv txoj kev tsis ncaj ncees. Piv txwv li, Complux's System System ua kom sov txauv muaj cov microchaynels uas nthuav dav thiab kev cog lus channel (nu) los ntawm 40% thiab txo qis lub siab poob los ntawm tsuas yog 12%.
3. Xaiv cov ntaub ntawv: kev ua tau zoo thiab cov txheej txheem yuav tsum ob qho haujlwm zoo.
Materials used in complex heat exchange structures must meet tight standards, such as having a high thermal conductivity (>100 w / min k), Raug tiv thaiv kev mob corrosion, thiab muaj peev xwm siv tau rau hauv 3D luam tawm. Cov tshuab siv hluav taws xob feem ntau yog tam sim no:
Aluminium Alloy, zoo li Alsi10MG
Nws qhov hnyav qis (2.7g /M³) thiab nruab nrab thermal conductivity (180 w / min k) ua rau lub zog cua txias zoo tshaj plaws rau lub zog hluav taws xob zoo tshaj plaws. Lub Platinum Blt - s1500 hack prints aluminium cua sov sib pauv uas 40% sib zog dua vim nws cov qauv cua dub. Nws tseem muaj cov txiaj ntsig ib lub zog ntawm 280 MPA tom qab kev kho cua sov.
Tooj liab alloys, zoo li Cucrzr thiab Cuni2sicR, muaj qhov kev ua haujlwm siab heev (401 W /Thm<5%). The Markforged Metal X system has used the "copper plastic composite wire+degreasing sintering" technology to print copper parts with a purity of over 99.8%. These parts have a thermal conductivity of 380 W/m · K, which makes them good for heat dissipation modules in 5G base stations. CuCrZr alloy is now the most used material for rocket engine cooling channels since it absorbs laser light 18% more quickly.
Nickel -} Raws li siab - kub alloys, zoo li in718
Hauv Aerospace teb, in718 tau dhau los ua cov khoom tseem ceeb rau nws lub zog kub (σ b> 1100mpa) thiab oxidation tiv taus ntawm 650 degree. Lub siab tau txo qis tus nqi tawg ntawm In718 cua sov hloov ntawm 1200 txog kev siv cov txheej txheem zoo ntawm 50 μ m) ua kom tiav cov qauv nruj rau cov cav.
4. Txheej txheem siv: Kev tswj tag nrho cov txheej txheem, los ntawm kev luam ntawv rau post {{1} kev ua
Nws yog ib qho nyuaj ua kom muaj kev sib pauv hloov kho cua sov
Algorithm rau ua kev txhawb nqa ntse
Kev tsim qauv tswj hwm cov tshuab los ntawm txhais tes tuaj yeem nkag ua kom muaj nyias - walled walled deformation. OQon 3Dxple Program tau siv lub tshuab kev kawm raws li cov txheej txheem txhawb nqa los ntawm kev txhawb nqa nyias zoo li cov qauv txhawb nqa tsis pub dhau 0.05 hli siv cov qauv encryption hauv zos.
Tshuab rau kev tswj hwm cov kev ntxhov siab uas muaj kev ntxhov siab
Kev nrawm Laser Melting tuaj yeem tsim kom muaj qhov ntsuas kub thiab txias uas tuaj yeem yooj yim zom cov khaubncaws sab nraud povtseg. SLM daws '"Substrate preheating + scaning lub tswv yim zoo" thev naus laus zis ntawm kev ntxhov siab ntawm 0.1% los ntawm preheating lub substrate mus rau 200℃thiab ntiav ib txoj kev kuaj xyuas.
Cov txheej txheem rau kev txhim kho qhov zoo ntawm qhov chaw
Qhov roughness ntawm saum npoo ntawm 3D luam ntawv (ra ntau dua lossis sib npaug rau 6 μ m) yuav ua rau nws tsawg dua ntawm kev sib pauv cua sov. Jizhan Technology's "tshuaj lom neeg polishing + Electrochemical machinity tshuab hloov pauv tsis tshua muaj ntxhib (rau RA0.4 μ 15% ntau thaj tsam ntawm microstructure etching. Qhov no ua rau 22% tag nrho kev txhim kho hauv kev hloov pauv kub.
5. Kev Siv Siv: mus ntawm qhov sim mus rau loj- nplai ntau lawm
Hlau 3D Printing Tshav Kub Kub Technology tau ua rau muaj kev sib tw loj hauv tus lej ntawm siab-}}}}}} Adal teb:
Thaj teb ntawm Aerospace
Tus 3D luam tawm cov roj txias tsim los ntawm pab pawg safran
Thaum nws los txog rau lub zog tshiab
NIO 3D {{{{{-}}}}}}}}}}}} Nplooj ntawv ntim khoom txias muaj phaj me me nyob sab hauv nws uas ua kom qhov kub sov sab hauv ± 1 degree. Qhov no ua rau lub roj teeb kawg 15% ntev dua cov qauv stamping thiab kev txiav cov hau kev ntawm 12 lub hlis mus rau 4 lub hlis.
Hauv tshav kub dissgermation teb
Intel's 3D luam tawm cov me nyuam liab siv hluav taws xob siv cov pob hluav taws kub ua kom cov hluav taws kub hauv qab 85℃ntawm tshav kub flux tsis zoo ntawm 100w / cm ². Qhov no ua rau nws 40% ntau npaum li cas nyob rau txias dua cov qauv kev kub yeeb nkab.