3D Printed Biosensors tuaj yeem cog rau hauv tib neeg lub tswv yim

Jun 30, 2022

Cov kws tshawb fawb ntawm University of Houston tau tsim ib txoj hauv kev tshiab ntawm 3D luam ntawv biosensors uas tuaj yeem muaj ib hnub cog rau hauv tib neeg tus tswv.


Siv multiphoton lithography (MPL), pab pawg neeg txoj kev muaj xws li polymerizing resins loaded nrog organic semiconductor cov ntaub ntawv txheej los ntawm txheej los tsim me me biocompatible circuit boards. Txog tam sim no, cov kws tshawb fawb tau siv lawv cov txheej txheem los tsim cov ntsuas ntshav qabzib siab, tab sis nrog kev tshawb fawb thiab kev txhim kho ntxiv, lawv ntseeg tias nws tuaj yeem ua txoj hauv kev rau kev tsim cov khoom siv bioelectronic tiam tshiab.


"Ntawm no, ib qho zoo li qub thiab pob tshab photosensitive resin doped nrog organic semiconductor (OS) cov ntaub ntawv tau qhia los tsim ntau yam 3D OS composite microstructures (OSCMs)," pab pawg tau hais hauv lawv daim ntawv. "[Peb] cov txiaj ntsig qhia tau tias muaj peev xwm zoo ntawm cov cuab yeej no rau ntau yam kev siv xws li hloov pauv bioelectronics mus rau nanoelectronics thiab organ-on-a-chip li."

3D printed microstructures


Nqa cov khoom cog cog rau lub neej

Hauv lawv daim ntawv, cov kws tshawb fawb tau txheeb xyuas MPL raws li "lub xeev-ntawm-tus-kos duab" thev naus laus zis hauv kev sau ntawv laser ncaj qha (DLW) 3D luam ntawv vim muaj ntau yam ntawm cov khoom siv thiab qhov siab precision nws tuaj yeem ua tiav (kev daws teeb meem mus txog 15 nanometers) . ). Yog li ntawd, pab pawg Houston pom cov thev naus laus zis zoo tshaj plaws rau kev tsim cov khoom siv nanoelectronic uas tau ua raws li kev tshawb fawb hnyav dhau ob peb xyoos dhau los.


Txawm li cas los xij, kev muaj peev xwm ntawm 3D luam ntawv xws li bioimplants tseem raug txwv los ntawm cov khoom siv hluav taws xob tsawg ntawm cov khoom siv los tsim lawv. Raws li cov kws tshawb fawb, qhov no yog vim cov qauv bioelectronics feem ntau yog ua los ntawm cov pa roj carbon nanotubes lossis graphene, yog li lawv muaj cov khoom siv tsis zoo uas yog "nyuaj rau kev sib cais tsis sib xws hauv cov resins" thiab "tsis muaj theem tseem ceeb sib cais."


Txhawm rau kov yeej cov kev tsis txaus no, cov kws tshawb fawb Houston tau tsim lawv tus kheej MPL resin, suav nrog DMSO-loaded PEGA polymer, PEDOT: PSS organic semiconductor, laminin, thiab qabzib oxidase, uas tuaj yeem ua tiav 3D luam tawm rau hauv mini-biomes Board nrog cov yam ntxwv zoo ib yam.

Organic Electronics 3D Printing Workflow


3D luam tawm cytocompatible PCB

Thaum pib, cov kws tshawb fawb tau siv lawv cov khoom siv los tsim ntau yam khoom siv hauv microelectronic, suav nrog cov ntawv luam tawm Circuit Board (PCBs), uas muaj cov array ntawm micro-capacitors. Thaum lawv tau ua kom pom qhov ua tau zoo ntawm lawv cov txheej txheem, pab pawg tau teeb tsa los sim nrog laminin, glycoprotein pom nyob rau hauv daim nyias nyias ntawm cov ntaub so ntswg sib txawv uas txhawb nqa kev sib txuas ntawm tes, taw qhia, thiab tsiv teb tsaws.


Tom qab thauj cov resin nrog cov protein, pab pawg tau mus rau 3D luam nws mus rau hauv ntau cov microstructures, uas tau coj mus rau hauv cov ntaub so ntswg rau 48 teev. Muab piv rau cov qauv uas tsis muaj kev kho mob, cov kws tshawb fawb tau sau tseg tias lawv cov hlwb tau pom cov pov thawj ntawm "kev ua kom muaj sia nyob" thaum tseem tuav lub peev xwm los txhawb kev sib txuas thiab kev loj hlob.


Tom qab txiav txim siab txog biocompatibility ntawm cov cog cog, cov kws tshawb fawb tau tshawb xyuas cov khoom siv hluav taws xob ntawm cov khoom siv no. Kev ntsuam xyuas ntawm cov kab mob lom neeg ntawm 1 kHz tau pom tias raws li txoj kab uas hla ntawm microelectrode nce, qhov hluav taws xob impedance ntawm pab pawg PCB tau txo qis ntawm txhua zaus (1 txog 105 Hz), nrog cov txiaj ntsig "raws li cov txiaj ntsig tau tshaj tawm yav dhau los"


Thaum kawg, txhawm rau ua kom pom qhov muaj peev xwm ntawm lawv txoj kev, cov kws tshawb fawb tau siv nws los tsim ib hom tshiab biosensor muaj peev xwm kuaj xyuas cov qib qabzib nrog kev ruaj ntseg siab thiab raug siv hluav taws xob tam sim no. Muab hais tias lub cuab yeej yog kaum npaug ntau dua li cov saib xyuas tam sim no, pab pawg hais tias lawv cov resin tam sim no tuaj yeem pab ua kom tib neeg kev vam meej ntawm cybernetic cog.


"Peb cia siab tias qhov pom tau tias MPL-tshaj OS cov khoom sib xyaw ua ke yuav tsim cov mos mos, bioactive, thiab conductive microstructures rau ntau yam kev siv hauv cov haujlwm tshiab xws li hloov pauv bioelectronics / biosensors, nanoelectronics, organ-on-a-chip, thiab kev tiv thaiv kab mob. Pave txoj kev. "cov kws tshawb fawb tau xaus rau hauv lawv daim ntawv.

3D-printed microstructures of group-infused laminin


Xa kev nug