Dab tsi yog qhov cuam tshuam ntawm hmoov residue ntawm kev ua haujlwm ntawm qhov chaw?

Ib, Lub cev thiab tshuaj lom neeg ntawm cov hmoov seem: Ib qho txuas los ntawm Microscopic Flaws rau Macroscopic Failure
Hmoov residue yog tsim los ntawm cov khoom uas tsis tau muab tshem tawm tag nrho thoob plaws hauv kev tsim khoom. Lawv muaj pes tsawg leeg, qhov loj me, cov duab, thiab kev faib tawm txhua qhov cuam tshuam ncaj qha rau qhov ua haujlwm zoo npaum li cas. Nyob rau hauv lub ntiaj teb no ntawm 3D luam ntawv nrog hlau, tshuav hmoov yuav muaj hlau hais uas tsis tau fused ua ke, oxide inclusions, los yog satellite hmoov (cov khoom me me uas lo rau cov khoom loj). Piv txwv li, tom qab siv Ti6Al4V hmoov 15 zaug hauv cov txheej txheem electron beam melting (EBM), oxide txheej ntawm cov khoom tau thicker. Qhov no ua rau fusion faults nyob rau hauv ib feem thiab ua rau nws 69 lub sij hawm tsis muaj peev xwm daws kev ntxhov siab. Qhov kev ua txhaum me me no yuav dhau los ua qhov tawg thaum cov khoom siv rov ua dua, uas yuav txwv nws txoj sia.
Nyob rau hauv lub ntiaj teb no ntawm electronics manufacturing, inorganic residues nyob rau saum npoo ntawm PCBA (luam Circuit Court board sib dhos), xws li carbonates thiab carbides nyob rau hauv soldering flux, muaj peev xwm txo cov rwb thaiv tsev tiv thaiv thiab nce to tam sim no. Cov kev sim tau pom tias thaum qhov seem seem ntau dua 0.1mg / cm ², qhov ntws tawm tam sim no ntawm cov pob qij txha tuaj yeem nce los ntawm peb qhov kev txiav txim siab. Qhov no tuaj yeem ua rau corrosion ntawm cov hlau nto hauv qhov chaw ntub dej, uas tuaj yeem ua rau kev sib cuag tsis zoo lossis txawm tias qhib Circuit Court tsis ua haujlwm. Organic residues zoo li rosin thiab roj tuaj yeem tsim cov txheej txheej insulating uas ua rau nws nyuaj rau kev sib txuas hluav taws xob ua haujlwm thiab ua rau muaj teeb meem tuaj thiab mus.
2, Txoj kev uas hmoov residue cuam tshuam rau ib feem ntawm kev ua tau zoo: ntau - nplai coupling nyhuv
1. Kev poob qis hauv kev ua haujlwm txhua yam: zais catalysts ntawm qaug zog thiab tawg
Hmoov residue hloov lub microstructure ntawm cov ntaub ntawv, uas hloov lawv txhua yam yam ntxwv. Txoj kev uas residual splashes yog kis tawm nyob rau hauv lub laser hmoov txaj melting (LPBF) txheej txheem yog intimately khi rau scanning mus kom ze. Cov kev tshawb fawb tau pom tias kev soj ntsuam hauv kev coj ntawm huab cua (piv txwv li, S-270 degree) tuaj yeem ua rau 30% nce ntawm cov khoom tawg ntawm cov hmoov av, tsim cov porosity los yog tsis tiav fusion flaws nyob rau hauv lub pas dej ua ke, yog li txo qhov ntom ntawm cov khoom. Kev sim cov ntaub ntawv qhia tau hais tias qhov qaug zog txwv ntawm 316L stainless hlau Cheebtsam nrog 0.5% ntim feem pua ​​​​ntawm qhov pores yog txo los ntawm 40% txheeb ze rau cov khoom tsis raug.
Kev siv hmoov ntau dhau tuaj yeem hloov pauv cov khoom ntawm cov hmoov, uas tuaj yeem cuam tshuam qhov chaw ua haujlwm zoo li cas. Piv txwv li, tom qab 15 kev siv 17-4PH stainless hlau hmoov, qhov loj me me ntawm cov hmoov faib tau nqaim (D10 mus ntawm 20.8 μm mus rau 25.3 μm), cov hmoov satellite txo qis, thiab fluidity nce 15%. Lub zog tensile tsis hloov ntau, tab sis lub voj voog siab qaug zog lub neej nce 20%. Qhov no yog vim tias cov hmoov siv rov ua dua tau siv ntau qhov sib npaug thiab cov kev ua txhaum hauv zos tau kho. Tab sis yog tias cov hmoov yog oxidized heev (xws li Ti6Al4V hmoov), ib qho nyuaj thiab nkig oxide txheej yuav tsim. Cov txheej no tom qab ntawd yuav yog txoj hauv kev zoo tshaj plaws rau cov kab tawg.
2. Kev ua haujlwm tsis tshua muaj kev ntseeg siab: qhov no yog ib qho teeb meem tshwm sim hauv electronics thiab biomedical sciences.
Hauv kev tsim hluav taws xob, kev phom sij ntawm cov hmoov seem zoo li "lub sijhawm foob pob." Kev tshawb xyuas ntawm qhov teeb meem hauv cov cuab yeej hluav taws xob hauv dav hlau tau qhia tias 0.3 μm cov plua plav tau nyob rau ntawm qhov chaw ntawm kev sib txuas nrog qhov zawj qhov sib nrug ntawm 0.5 μm, ua rau muaj qhov ua txhaum ntawm lub pinhole thiab lub gadget tsis ua haujlwm tom qab 2000 teev ua haujlwm. Cov hmoov talc tshuav (1-10 μm) nyob rau sab nraud ntawm cov hnab looj tes kho mob kuj tuaj yeem nqa cov kab mob los yog cov protein latex, uas tuaj yeem ua rau muaj kev fab tshuaj. Kev tshawb fawb soj ntsuam qhia tau hais tias kev siv cov hnab looj tes uas muaj 0.5mg / g talc hmoov nce qhov kev pheej hmoo ntawm kev tsis haum tshuaj ntawm cov neeg ua haujlwm kho mob los ntawm 2% mus rau 15%, nrog rau cov mob hnyav uas ua rau muaj kev poob siab anaphylactic.
3. Cov txheej txheem cuam tshuam: Cov nyhuv ntawm cov hmoov txaj ntawm lub tshuab hluav taws xob nitrogen ntawm qhov system
Powder residue kuj tuaj yeem cuam tshuam qhov ua haujlwm zoo npaum li cas los ntawm kev nkag mus rau hauv txoj kev tsim khoom. Thaum koj khawb lossis zeb ceramics, aluminium oxide plua plav (hardness HV2000) ntxiv rau cov txheej txheem kev tsheb nqaj hlau yuav khawb qhov chaw ntawm cov ntawv qhia kev tsheb ciav hlau zoo li cov ntawv xuab zeb. Qhov no yuav ua rau kom qhov roughness Ra ntawm 0.2 μm mus rau 1.0 μm, uas yuav txo qis qhov tseeb ntawm kev ua haujlwm los ntawm 50%. Tom qab pulverising carbon molecular sieve nyob rau hauv lub tshuab hluav taws xob nitrogen, cov hmoov kuj yuav thaiv cov ntws channel ntawm lub adsorption ntauwd. Qhov no yuav txo cov nitrogen purity los ntawm 99.99% mus rau 95%, uas tsis zoo txaus rau kev ua hluav taws xob chips. Qhov no yuav ua rau 30% nce ntawm cov khoom seem ntawm cov khoom.
3, Tswj lub tswv yim thiab thev naus laus zis Frontier: Los ntawm Passive Clearance mus rau Active Tiv Thaiv
1. Txheej txheem optimisation: txiav tawm ntawm qhov chaw ntawm cov khoom seem
Tsim ib lub tswv yim scanning: Siv S-45℃lossis S-180℃scanning kev taw qhia hauv LPBF txheej txheem tuaj yeem txo qis ntawm kev sib tsoo thiab cov hmoov av tshuav li ntawm 40%.
Kev tswj cov hmoov: Kom cov hmoov tsis txhob sib koom ua ke vim tias nws muaj cov hmoov zoo ntau dhau (<20 μ m), you can use screening (such a 150 μ m sieve) and air flow classification to control the size of the particles. For instance, one airline cut the amount of 3D printed powder from 15% to 8%, and the parts' porosity went down from 0.8% to 0.2%.
Kev tswj ib puag ncig: Ua kom lub rooj cob qhia hluav taws xob huv si rau ISO Class 5 (Class 100) cov qauv tuaj yeem txiav cov khoom seem ntawm cov khoom paug ntawm PCBA los ntawm 90% thiab qhov ua tsis tiav los ntawm 75%.
2. Kev siv tshuab ua kom zoo: los ntawm kev ua los ntawm tes mus rau kev siv tshuab
Kev tu txoj kev uas muaj kev nyab xeeb los ntawm kev tawg: Tuobo additive TCB series system yog tsim los ntxuav lub sab hauv ntawm loj 3D luam ntawv workpieces thaum tiv thaiv lawv los ntawm inert roj. Nws muaj cov hmoov rov qab ntawm 98% thiab txo cov sij hawm ua hauj lwm los ntawm 90%.
Lub tshuab kas fes uas tawm hauv xyoo 2025 muaj cov cuab yeej no, uas siv cov- zaus vibrations kom tshem tawm cov yeeb nkab txuas thiab txo cov hmoov kas fes uas nyob hauv lub tshuab los ntawm 3% mus rau 0.5%.
Nano qib tshawb pom: Cov seem morphology ntawm cov hmoov yog tshuaj xyuas los ntawm txoj kev laser diffraction (nrog qhov tseeb ntawm 0.1 μm) lossis scanning electron microscopy (SEM). Qhov no muab cov ntaub ntawv txhawb rau cov txheej txheem optimisation.
3. Cov ntaub ntawv tshiab: txo qis cov residual rhiab heev
Tsim cov hmoov uas tsis tshua muaj residue: Ua cov hmoov uas muaj lub ntsej muag zoo nkauj thiab ntws zoo (xws li roj atomised 316L stainless hlau hmoov, Hall flowmeter ntsuas flowability25s / 50g) kom txo qis ntawm splashing thaum faib cov hmoov.
Biodegradable txheej: Sugarcane fiber yog siv los npog cov hnab looj tes kho mob. Cov fiber ntau no tuaj yeem swell hauv dej, uas tuaj yeem txo cov hmoov seem seem ntawm 20% thiab txo qhov kev pheej hmoo ntawm kev ua xua.
Dynamic siab rho tawm: Hauv kev tsim cov tshuaj ntsiav kas fes, segmented siab tswj yog siv los txhim kho cov dej ntws, uas txo cov hmoov zoo uas nyob hauv kas fes los ntawm 15%.